Sheet No.: DG-0089001
3
GM5BW96385A
?SPAN class="pst GM5BW96385A_2662290_2">Absolute Maximum Ratings
*
1 Duty ratio = 1/10, Pulse width = 0.1 ms
*
2 Thermal resistance, junction-to-case = 95癈/W
*
3 Case temperature (See External Dimensions on page 2)
*
4 Do not exceed these temperatures under any condition while in packing.
Refer to Storage and Handling.
*
5 Each terminal must be soldered with a 30 W soldering iron within 3 seconds under 295癈.
For Reflow Soldering information, see Fig. 15.
*
6 Operating current values here follow the derating curves shown in Fig. 1 through Fig. 3.
*
7 This device uses the leads for heat sinking, therefore the operating temperature range is prescribed by Tc.
?SPAN class="pst GM5BW96385A_2662290_2">Electro-optical Characteristics
*
1 Measured by EG&G Model 550 (Radiometer/Photometer) after 20 ms drive (Tolerance: ?5%)
*
2 Measured by Otsuka Electronics Model MCPD-2000 after 20 ms drive (Tolerance: x, y: ?.02)
*
3 See Chromaticity Rank table on page 8.
*
4 Parenthesis indicate reference values.
?SPAN class="pst GM5BW96385A_2662290_2">Derating Curves
Parameter
Symbol   Rating   Unit
Power dissipation
P
114    mW
Forward current
I
F
30
mA
Peak pulsed forward current *1   I
FM
100    mA
Forward current derating factor
DC
0.6    mA/癈
Pulse
2.0    mA/癈
Reverse current
I
R
70
mA
Junction Temperature *2
Tj
125
Operating temperature *3
Tc   -30 to +100  癈
Storage temperature *4
Tstg   -40 to +100  癈
Soldering temperature *5
Tsol
295
Parameter
Symbol
Conditions
MIN.
TYP.
MAX.   Unit
Forward voltage 1
V
F1
I
F
 = 10 礎
2.0

2.7    V
Forward voltage 2
V
F2
I
F
 = 20 mA

(3.2)
3.8    V
Luminous intensity *1
I
V
1800    (2300)
3100   mcd
Chromaticity coordinates *2
x, y
(0.34, 0.36)
*3
Fig. 1 Forward Current
vs.Case Temperature
0
-40  -20
-30    0  20  40  60  80  100 120
10
20
30
40
50
60
70
Case Temperature Tc (癈)
-
Fig. 2 Peak Pulsed Forward Current
vs. Duty Ratio
0
1/100
1/10
1
(Tc = 25癈)
20
40
60
80
100
120
Duty Ratio
M BW   A-4
(Tc = 25癈)
(Tc = 25癈)
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